SK실트론

1. 

   1 POLY SILICON
   STACKING

   Process of filling high purity poly-crystal silicon in quartz crucible

2. 2 INGOT
   GROWING

   Process where poly-crystal silicon is melted in high temperature then grown into single crystal ingot

   
3. 

   3 INGOT GRINDING
   & CROPPING

   Process of making the surface of ingot smooth then cropping into blocks

4. 4 WIRE
   SAWING

   Process of cutting the ingot block into single wafers

   
5. 

   5 EDGE
   GRINDING

   Process of shaping the edge of the wafer

6. 6 LAPPING

   Process of making the surface of the wafer smooth and flat

   
7. 

   7 ETCHING

   Process of eliminating process damages on wafer surface using chemical reaction

8. 8 DOUBLE
   SIDE GRINDING

   Process of removing small bumps on the wafer surface

   
9. 

   9 POLISHING

   Process of removing fine bumps on the wafer through precision processing

10. 10 CLEANING

    Process of eliminating impurities on the wafer surface

    
11. 

    11 INSPECTION

    Process of inspecting the quality of wafer such as shape and flatness

12. 12 PARTICLE
    COUNTING

    Process of inspecting defects in wafer surface

    
13. 

    13 EPITAXIAL
    GROWING

    Process of adding silicon single crystal layer on wafers

14. 14 PACKING

    Process of packaging the product to protect it from shock, dust and humidity

    

300mm Silicon Wafer Manufacturing Process

1. 1 POLY SILICON STACKING
2. 2 INGOT GROWING
3. 3 INGOT GRINDING &
   CROPPING
4. 4 WIRE SAWING
5. 5 EDGE GRINDING
6. 6 LAPPING
7. 7 ETCHING
8. 8 DOUBLE SIDE GRINDING
9. 9 POLISHING
10. 10 CLEANING
11. 11 INSPECTION
12. 12 PARTICLE COUNTING
13. 13 EPI GROWING
14. 14 PACKING