SK siltron

300mm Epitaxial Wafer

Wafer

Semiconductor Value Chain

  • Poly Silicon POLY SILICON
  • Ingot / Wafer INGOT / WAFER
  • Patterned Wafer PATTERNED WAFER
  • Semiconductor SEMICONDUCTOR
  • Electronic Product ELECTRNIC PRODUCT
200mm
300mm
Polished Wafer
Polished Wafer is a thin disc-shaped single crystal silicon product manufactured from high-purity poly-crystalline silicon by undergoing melting, crystal growth, cutting, polishing and washing processes. It is produced in diameters of 200mm/300mm and is usually used in the manufacture of memory semi-conductors such as DRAM/NAND Flash Memory.
200mmNon-memory chip
Logic (Drive IC) Logic (Driver IC)
Sensor Sensor
300mmMemory chip
DRAM DRAM
FLASH (NAND) Flash(NAND)
200mm
300mm
Epitaxial Wafer
Epitaxial Wafer is made by adding multi-nanometer thick silicon single crystal layer on top of Polished Wafer. EPI Wafer is used in non-memory chips such as Logic Devices and CMOS image sensors. Its demand is gradually increasing for next-generation wafers.
200mmNon-memory chip
Analog (PMIC) Analog (PMIC)
Power Discrete Power Discrete
CIS CIS
300mmNon-memory chip
MPU MPU
CIS CIS
Logic (Drive IC) Logic (Driver IC)

Core Technology

SK siltron offers advanced solutions for future markets that demand
higher perfection and to satisfy the various needs of
global partners based on world-class defect free crystalline,
super flat surface control and small size particles control technology.

  • CRYSTAL DEFECT FREE
    SK siltron designs single crystal growers using in-house technology and achieves high purity crystal quality through precision control over silicon’s
    crystal defect and chemical composition.
    • Core Tech. 1 In-house grower design competency for high-purity crystal manufacture
    • Core Tech. 2 Crystal technology for controlling contamination, defects and oxygen concentration
  • SUPER FLAT SURFACE CONTROL
    Produces zero-contamination level silicon wafers using high purity cleaning technology
    • Core Tech. 1 Technology for eliminating and controlling below 1/10 billion impurity particles
    • Core Tech. 2 Metal control technology within wafer surface and bulk
  • SMALL SIZE PARTICLE CONTROL
    Achieves optimal super flat surface through physical and chemical polishing technology.
    • Core Tech. 1 Shaping control technology that improves the flatness of wafer
    • Core Tech. 2 Technology for producing super flatness that eliminates deformed layers in wafers